Our company specializes in design, proto typing and manufacturing of fine pitch PCB assemblies having fine pitch components such as ball grid arrays, micro BGA, TQFPs, Flip-chips, Chip scale packages(CSPs).
The proto typing of fine pitch boards is carried out using following steps
Evalution of Design, Cad layouts, Gerber files
Inspection of inward material (PCB, Components and Raw material)
Programing of devices for automated assembly on Pick and place machines (Multi function chip mounter)
In process Quality control and inspection at working stages namely Stencil painting, chip mounting, Reflow soldering.
Validation of process Data of various parameters Required in fabrication Of PCBS, Stencils and setting of temperatures at various zones in Reflow Profile.
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